IBM Z13

Description

IBM Z13(2964)

  • The z13 CPC has been redesigned to package processors in drawers. A z13 CPC drawer contains eight single chip modules (SCMs), memory, symmetric multiprocessor (SMP) connectivity, and connectors to support PCIe I/O drawers (through PCIe fanout hubs), I/O drawers through InfiniBand features, and coupling links to other CPCs. The z13 server can have up to four CPC drawers installed (the minimum is one drawer)
  • On the Z13 Each CPC drawer can contain up to 3,200 GB of physical memory, for a total of 12.5TB of installed (physical) memory per system. Part of the physical installed memory is used to implement the RAIM design. This configuration results in up to 2.5TB of available memory per CPC drawer and up to 10 TB per system.
  • The Z13 supports up to 5 I/O Drawer that use Peripheral Component Interconnect Express Generation 3 (PCIe Gen3) I/O infrastructure. it support 16 GBps I/O bus interconnection for CPC drawer connectivity to the PCIe I/O drawers.
  • For a four CPC drawer system, up to 40 PCIe and 16 InfiniBand fanouts can be configured for data communications between the CPC drawers and the I/O infrastructure, and for coupling.The multiple channel subsystem (CSS) architecture allows up to six CSSs, each with 256 channels.
  • IBM Processor Resource/Systems Manager™ (PR/SM™) enables z13 servers to be initialized for a logically partitioned operation, supporting up to 85 LPARs. Each LPAR can run its own operating system image in any image mode,independently from the other LPARs.
  • Flash Express provides 1.4 TB of storage per feature pair. Up to four pairs can be installed, for a total of 5.6 TB.

 

Model Summary Matrix

Model

CPC Drawers

PUs

Memory (GB)

MIPs

N30

1

1 to 30

64 – 2,464

32,671

N63

2

1 to 63

64 – 5,024

59,947

N96

3

1 to 96

64 – 7,584

83,453

NC9

4

1 to 129

64 – 10,144

104,395

NE1

4

1 to 141

64 – 10,144

111,556

 

 

Processor Unit Summary

Model

CPs

IFLs

Unassigned

 IFLs

zIIP

ICFs

IFPs

Standard

SAPs

Additional

SAPs

 

Spares

N30

0 - 30

0 - 30

0 - 29

0 – 20

0 - 30

1

6

0 - 4

2

N63

0 - 63

0 - 63

0 - 62

0 – 42

0 - 63

1

12

0 – 8

2

N96

0 – 96

0 – 96

0 – 95

0 - 64

0 – 96

1

18

0 – 12

2

NC9

0 – 129

0 – 129

0 – 128

0 - 86

0 – 129

1

24

0 – 16

2

NE1

0 - 141

0 - 141

0 - 140

0 - 94

0 - 141

1

24

0 - 16

2

 

 

  • In the five-model structure, at least one CP, ICF, or IFL must be purchased and activated for any model.
  • System Assist Processor (SAP) used by the channel subsystem. The number of predefined SAPs is dependent on the zEC12 model.
  • One integrated firmware processor (IFP). The IFP is used in support of select features, such as zEDC and 10GbE RoCE.
  • Central processor (CP) for general-purpose use
  • Integrated Facility for Linux (IFL) for the use of Linux on z Systems.
  • System z Integrated Information Processor (zIIP). The number of installed zIIPs cannot exceed twice the number of installed CPs.
  • Internal Coupling Facility (ICF) to be used by the Coupling Facility Control Code (CFCC).

 

I/O Feature

Storage Connectivity

FICON EXPRESS16S LX/SX

FICON EXPRESS8S LX/SX

FICON EXPRESS8 LX/SX

Network Connectivity

OSA-EXPRESS5S 10 GbE LR/SR

OSA-EXPRESS5S GbE LX/SX

OSA-EXPRESS5S 1000BASE-T

OSA-EXPRESS4S 10 GbE LR/SR

OSA-EXPRESS4S GbE LX/SX

OSA-EXPRESS4S 1000BASE-T

10 GbE RoCE Express

Cryptography

Crypto Express5S

zEDC Express

Flash Express

Coupling Links

IC (Internal Coupling links)

ICA SR(Integrated Coupling Adapter Short Reach)

HCA3-O, 12x Parallel Sysplex InfiniBand (IFB) coupling links

HCA3-O LR, 1x Parallel Sysplex InfiniBand (IFB) coupling links

Want to Know More Solutions?

Please publish modules in offcanvas position.